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Laptop and iPad Heatsink

The Laptop and iPad Heatsink is engineered for efficient thermal management in portable devices. It features a C1100 copper substrate, A1050 H24 aluminum fins, and a durable SUS304 bracket. The copper substrate undergoes CNC machining with anti-oxidation treatment, while the aluminum fins are nickel-plated for added protection. This heatsink utilizes a heat pipe, secure welding, and a riveted bracket, ensuring optimal heat dissipation and reliability for high-performance laptops and tablets.
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Ultra-Thin Aluminum Heat Sink, Compatible with Various Devices
Ultra-Thin Aluminum Heat Sink, Compatible with Various Devices
Ultra-Thin Aluminum Heat Sink, Compatible with Various Devices
Ultra-Thin Aluminum Heat Sink, Compatible with Various Devices
Usage ScenariosLaptop, iPad
MaterialC1100 substrate + A1050 H24 aluminum fins + SUS304 bracket
Manufacturing ProcessCopper substrate CNC machining (anti-oxidation) + aluminum stamped fins (nickel plating) + heat pipe + welding + riveted bracket


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